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One-component Thermal Gel
Thermal gel is a paste-like interface material formulated with silicone oil as the base matrix and filled with high thermal conductivity ceramic powders (such as alumina and boron nitride). It is a non-curable product that permanently maintains paste fluidity and requires no curing reaction; it is ready for use once opened. It can continuously fill tiny gaps between heat sources and heat dissipation structures for a long time, replacing air layers to achieve efficient heat conduction. Featuring easy rework and stress-free properties, it is an ideal option for precision electronic components and detachable heat dissipation applications.
Permanent paste state with no curing required: Using silicone oil as the carrier, it does not cure via moisture absorption or chemical reactions and retains paste fluidity all the time. It prevents thermal resistance fluctuations caused by curing shrinkage, making it suitable for scenarios requiring long-term rework or disassembly.
Widely applied in the lighting industry (floodlight heat dissipation, automotive headlamps, downlights), electrical and electronic industry (desktop computer heat dissipation, circuit board component heat dissipation), etc.
